High-Speed PCB & Enclosure Design

PROJECT BRIEF: HIGH-SPEED INDUSTRIAL SENSOR NODE MODULE (PCB LAYOUT & CNC ENCLOSURE) I am building a compact, high-performance module that combines a 600 MHz ARM SoC in a BGA-196 package with a 30W smart amplified RF transceiver node. I need two tightly coordinated pieces of engineering work, which can be awarded as independent contracts to separate specialists, or as a unified project to a full-stack engineer: 1. High-speed 4–6-layer PCB layout (Target Fixed-Price Budget: £800 - £1,600) 2. Precision CNC-machined enclosure in 6061-T6 aluminum (Target Fixed-Price Budget: £400 - £800) -------------------------------------------------------------------------------- DISCIPLINE 1: PCB HARDWARE LAYOUT DESIGN -------------------------------------------------------------------------------- The board must run cleanly at high clock rates, so signal integrity, temperature control, and full EMI/EMC compliance are non-negotiable. Whether you prefer Altium Designer, Allegro, or KiCad is up to you; I’ll adapt to the tool you’re most productive in. CRITICAL DETAILS: - Board 1 Footprint Layout: Strict 65mm x 20mm spatial constraint footprint. - Silicon Escape Routing: High-density automated routing for three (3) NXP BGA-196 microprocessors positioned side-by-side horizontally. - Component Connectivity: SMT Micro Friction Sockets (Mill-Max 8421 Series or equivalent) must be integrated directly onto the top layer of Board 1 to facilitate solderless, toolless sensor pin swaps. - Trace Parameters: Expect differential pairs, 50-ohm single-ended controlled impedance traces, and a stack-up that balances cost with performance. Continuous ground plane shielding must isolate the analog front-end from digital clock noise. - Deliverables: Native design file, Gerber/ODB++, BOM with accurate manufacturer part numbers, Pick-and-Place Centroid coordinate files (CPL), impedance report, and fabrication notes. -------------------------------------------------------------------------------- DISCIPLINE 2: PRECISION ENCLOSURE DESIGN (CNC MACHINING) -------------------------------------------------------------------------------- The enclosure has to protect the RF section, provide solid thermal paths, and still keep weight down. I need machining strategy, 3-D CAD, and 2-D manufacturing drawings that hit tight tolerance levels, call out surface finishes suitable for Type II Satin Black Anodizing, and respect the weight budget. CRITICAL DETAILS: - Enclosure A Dimensions: External dimensions capped at 65mm x 20mm x 10mm. Internal component pocket clearance must fit a strict 3.5mm component height profile, shielded by a rigid 1.0mm bolt-down floor plate. The top tier must support a hinged protective cover swinging on a rear axis, secured by a low-profile knurled front thumb-screw latch. Cover must clear six sliding vertical-travel adjusters. - Enclosure B Dimensions: A telescopic compression clamp adapting to object depths spanning 35mm to 120mm. Relies on overlapping vertical tracks guided by dual hardened steel rails, locked via a precision 0.5mm rachet track and quick-release detent plunger. - Cavity Routing: Integrate an isolated slide-out battery drawer cartridge channel and allow a 0.75mm clearance envelope on all clamping faces for fluorosilicone rubber shims. - Deliverables: STEP/Parasolid model, fully dimensioned 2D engineering blueprints with tolerances detailing thread tapping (M1.6, M2), CAM-ready files, material and finish specs. -------------------------------------------------------------------------------- ACCEPTANCE & MILESTONE TERMS -------------------------------------------------------------------------------- This project will be executed strictly on a Fixed-Price Milestone basis via Escrow. I’ll sign off and release respective funds once the PCB layout passes a zero-error ERC/DRC check, simulation plots show safe margins, and the enclosure drawings machine cleanly in a test CAM pass. If you are an expert who can own either side—or both—please submit your proposal, state which discipline you are bidding on, and answer the attached screening questions.

Project ID: 40719504