Looking for someone with good solid background in thermal simulation. We are designing a package for a camera core. The sensor will be integrated with an image processing CMOS ASIC using a PCBA. The assembly will then be house in ceramic base package, capped with a few possible choices of material. We need thermal simulation to be perform on the package based on the selection of material for the housing and also the interface material for heat spreading. The thermal simulation is to determine the best combination that will result in 0 or near 0 thermal gradient of the device across desired working temperature.
Bu iş için 21 freelancer ortalamada $1119 teklif veriyor
Hi there, I have designed multiple casings for electronics and have conducted CFD, thermal and stress analysis of the enclosure. The work i have done includes both natural and forced convection. I would like to underst Daha Fazla
Hello I am a mechanical engineer and a [login to view URL] holder. As my M.Sc. I did a research on developing a model to carry out LES simulations of flow and combustion in IC engines. I have also done a lot of projects using Ansys ( Daha Fazla
ibhave great experience in finite element analysis ,i can perform non linear simulations of thermal conditions of camera casing lets discuss details in chat budget is negotiable upon pronlem clarification
hi I'm expert in ansys and abaqus. I can help u in solving the problem. further I would like to discuss about the project in detail. thank you