We are a team so can do quickly any big job
We have more than 14 years of electronic designs.
We are designers of High-speed applications (FPGA Based PC cards equipped with DDR2/DDR3/DDR4 memories, Gbit links, High-speed clocks, PCI-E, USB2.0/3.0/3.1, High-speed FPGA FPGA interfaces, etc.), RF, Power.
We are rich experience in Candence (Allegro, Orcad, Lay out Plus, HDL)and Altium, Mentor graphic(Pads, Expedition)
With more than ten years worked for one service company in SanJose, CA, USA. We have done a lot of jobs for big companies such as Cisco, Intel, Altera, KLA, Samsung,...
1/. Cisco
- Position: Leader
- Detail: Layers (30), Components (12000), High speed, SGMII, XAUI, XFP, SFP, Backplane SERDES, PCIe, DDRx, Back drill...
2/. INTEL
- Position: Leader
- Detail: Layers (16), Components (3400), High speed 10G, QSFP, PCIe, DDR4 DIMM, Ethernet, Blind via and Buried via, Back drill...
3/. CADENCE
- Position: Leader
- Detail: Layers (30), Components (8000), High speed 20G, QSFP, PCIe, DIMM, Ethernet, Back drill...
4/. CPACKET
- Position: Leader
- Detail: Layers (18), Components (8500), High speed 40G, SFP, PCIe, DDRx, Ethernet, Back drill...
5/. WESTERN DIGITAL
- Position: Leader
- Detail: Layers (22), Components (6000), High speed 40G, SFP, PCIe, Ethernet, Backdrill...
6/. FACEBOOK
- Position: Leader
- Detail: Layers (20), Components (3500), High speed 10G, RF, SFP, PCIe, Ethernet …